Samsung Electronics is aiming for a goal of over 3TB/sec bandwidth for its next-gen HBM4E memory, aims for up to 3.25TB/sec ...

AMD showcases its next-gen Helios rack-scale platform: combining next-gen Instinct AI GPUs, EPYC CPUs, and more to battle ...

Oracle has announced an expansion of its partnership with AMD at its annual AI World conference, revealing it will become the ...

Micron claims 2.8TB/s bandwidth for HBM4, surpassing JEDEC baseline and rivalsSamples of next-gen memory shipped to customers ...

Micron announces industry leading HBM4 with 2.8TB/s bandwidth and 11Gbps pin speeds, claiming performance advantage over ...

Micron Technology, Inc. is a top AI memory stock, with strong growth, margin expansion, and innovation driving upside. Learn ...

SK hynix has pulled ahead of its memory rivals by bagging NVIDIA’s first HBM4 orders, giving the South Korean chipmaker a premium position for the launch of Nvidia's Rubin GPUs. According to DealSite, ...

Set for deployment in 2026 with OEM and ODM partners, Helios complies with standards from OCP, as well as DC-MHS, UALink, and ...

Buy-rated Samsung Electronics is poised for “structural earnings growth” as the shortage of HBM and DRAM is expected to persist through 2027, according to a note from KB Securities.

SK hynix says it has wrapped up development of its HBM4 memory and is ready to churn it out for the AI bubble boom. The outfit insists this makes it the first in the world to move the next-generation ...

Nvidia has approved Samsung's 5th generation HBM3E memory for its AI accelerator, marking Samsung's return to the supply ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first HBM4 controller and PHY IP. This test chip was implemented using TSMC's ...