With continuous device scaling, process windows have become narrower and narrower due to smaller feature sizes and greater process step variability [1]. A key task during the R&D stage of ...
DPT is a critical technique for ensuring printability of device and interconnect layers in 20-nm IC manufacturing. However, splitting layers into two masks can introduce timing variations as a ...
Researchers, equipment vendors, and manufacturers alike are watching with growing concern as we creep every closer to the end of 193 nm optical lithography. The problem is not that there are no ...