As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and ...

TOKYO--(BUSINESS WIRE)--Nikon Corporation has announced release of the NSR-S622D ArF immersion scanner to deliver world-class overlay and ultra-high productivity for the most demanding multiple ...

Layout decomposition represents a critical step in the semiconductor manufacturing process, whereby integrated circuit designs are partitioned into multiple layers or masks to overcome the inherent ...

2019 marked an important milestone for extreme ultraviolet (EUV) lithography. In that year, the EUV patterning technology was for the first time deployed for the mass production of logic chips of the ...

Applied Materials unveiled a new technology to complement ASML's EUV equipment, helping chipmakers remove the need for multiple patterning and creating economic and environmental benefits. Save my ...

The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies ...