BILLERICA, Mass.--(BUSINESS WIRE)--NEXX Systems today announced a multi-year joint development program with IBM on advanced semiconductor chip packaging and integration. In the program, IBM and NEXX ...
Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...
Impact of PCB plating Finish on Elastomer Socket Technology Ila Pal – Ironwood Electronics Introduction Today’s electronic packages have high clock speeds (multi GHz range), fine pin densities (below ...
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