GigaDevice and Navitas have created a joint digital power laboratory, intending to combine GigaDevice’s 32bit microcontroller products and expertise with power comonents and related knowledge from ...

Taking only those written in the last week, the most popular stories on our website cover stacking packaging for power modules, EC proposals for a European Space Shield, and Molex buying Smiths ...

It is the JESD328: LPDDR5/5X Small Outline Compression Attached Memory Module (SOCAMM2) Common Standard. The association says JESD328 is designed to provide a memory platform to deliver modular, ...

Using this technology, pixels measuring ~560nm across can be achieved, equating to 25,000dpi, according to the researchers.

Researchers from the Institute for Artificial Intelligence at Peking University, led by Sun Zhong, have developed a ...

Glass adoption is accelerating from various entry points in high-end performance packaging, including packaging for AI accelerators, HPC, and RF telecom markets, and is building the pillars of a new ...

This is a replica of a contraption which made history on March 10th 1876. Keep up with developments relating to space ...

RED Semiconductor has launched Ordo1, a new IP core designed for RISC‑V processors, and announced its membership in RISC‑V ...

Imec CEO Luc Van den hove (pictured), Baden-Württemberg’s Minister-President Winfried Kretschmann, and Minister of Economic Affairs, Labour and Tourism Dr. Nicole Hoffmeister-Kraut have officially ...

Make sure to listen to the latest episode of the excellent Electronics Weekly podcast, CHIIPS. It features Joe Stockunas, president of SEMI Americas. CHIIPS is brought to you by our editor Caroline ...

Steve Bush, technology editor Electronics Weekly took a quick look at the technology behind the eye implant that was in the news this week for restoring some kind of sight to suff ...

Paris-based Vsora is “now in production”, it said, of its promised Jotunn8 AI inference chip for data centers.