CHICAGO, June 30, 2026--nVenia adopts CADDi's AI platform to unlock the full value of decades of engineering, procurement, ...

Based on 10.1 million packaging design projects, Pacdora has published what it believes is the industry's first ranking ...

Asahi Kasei opens new slitting facility in Taiwan to boost semiconductor packaging materials production amid rising AI demand ...

Ship-in-own-container (SIOC) packaging enables products to ship safely without an extra box, reducing waste and costs.

Space-constrained chemical containers are transitioning to cloud-connected QR codes and NFC tags to bypass physical label limitations and secure instant safety data access.

Sustainability is no longer simply a branding strategy—it is becoming a legal obligation. The new EU Packaging and Packaging ...

The market for fan-out panel-level packaging (FO-PLP) and glass substrates is set to grow more than tenfold in five years, as Intel, TSMC, and others race to adopt the large-area packaging that ...

California faces a lawsuit that targets its 2022 plastic ban, which took effect earlier this year. What does this mean for ...

They are a convenient, comforting, innocent indulgence, say the defenders of so-called ultra-processed foods. Critics trash ...

Sysco's EPR reporting journey reveals critical data challenges. Explore how the new GS1 data model solves inconsistencies and ...

Soaring AI/HPC device demand is driving leading-edge foundries to support the transition from wafers to panels to accommodate increasingly larger device sizes. But to ensure that panels with multiple ...