Singapore, Micron Technology

Micron To Build $7 Billion Advanced Chip Facility In Singapore Amid AI Boom
Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor giant expands its capacity to cater to booming demand for AI chips.
Singapore slots itself into the HBM supply chain—key to the AI boom—with a $7 billion Micron investment
It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new heights.
Micron building Singapore chip facility as part of $7B investment
Micron Technology (MU) is building a chip plant in Singapore, as part of an approximately $7 billion investment to meet artificial intelligence (AI) data center demand. The new HBM (high bandwidth memory) advanced packaging facility is a significant step for Singapore amid ongoing efforts to expand AI capacity across the globe.
Micron breaks ground on $7B HBM packaging facility in Singapore
Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.
Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total advanced packaging capacity beginning in calendar 2027 to meet the demands of AI growth.
Singapore strengthens AI edge with Micron’s $7B investment in HBM
Singapore is set to solidify its position in the global semiconductor supply chain with Micron Technology’s announcement of a $7 billion investment in a high-bandwidth memory (HBM) packaging facility.
Micron’s $9.5b chip plant to give Singapore foothold in AI space; will create up to 3,000 jobs
Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...
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Micron's $7 Billion Bet on AI-Driven Memory In Singapore Facility Set to Boost Innovation
Micron Technology, Inc. (NASDAQ: MU) broke ground on a new HBM advanced packaging facility in Singapore, expanding its capacity and creating jobs.
Micron may be a winner in the wake of Nvidia CEO Jensen Huang’s CES keynote
Huang’s hotly anticipated speech brought mention that Micron is providing memory for new Blackwell gaming chips.