Chip smuggling prevention; AI export controls and deals; OSAT revenue up; AI PC memory chipsets; big fundings and buybacks; ...

Two standards — Bunch of Wires (BoW) and UCIe — compete with proprietary designs. Today, the latter predominates, since ...

Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has ...

Supply chain vulnerabilities, hardware attacks, and communications hacks are rife. Autonomous technology poses extra threats.

High-voltage PCB spacing; HBM4; AI changes engineering teams; ion beam etching; wafer market and raw materials.

Benchmarking 3D-IC cooling; rad-hard flip-flops; high-speed data error correction. Researchers from Massachusetts Institute ...

A new technical paper titled “Memory Prefetching Evaluation of Scientific Applications on A Modern HPC Arm-based Processor” ...

Just adding more or thicker wires to a design isn't sufficient with chiplets.

An Open-Source and Configurable RISC-V Graphic Processing Unit for TinyAI Applications” was published by researchers at EPFL.

Experts At The Table: The explosion in AI data is driving chipmakers to look beyond a single planar SoC. Semiconductor Engineering sat down to discuss the need for more computing and the expanding ...