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I added one small device to my network rack and power blips stopped taking down my smart home

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IEEE

Fast and Accurate Machine Learning Prediction of Back-End-of-Line Thermal Resistances in Backside Power Delivery and Chiplet Architectures

Abstract: Heat dissipation is a critical issue in a backside power delivery network (BSPDN) chip package because heat from the powered transistors must travel through the signal interconnects (that ...