Backed by leading tech giants, the investment reinforces domestic semiconductor production and U.S.-based innovation in ...

TEM image of 16nm pitch Ru lines after Ru etch. Ruthenium (Ru) semi-damascene has been originally proposed by imec as an ...

EVG MLE Technology Advantages LITHOSCALE XT tackles legacy bottlenecks associated with steppers by combining powerful digital ...

Jean-Philippe Bourgoin, Deputy Executive Director of the Technological Research Division, CEA & Director of Component and ...

Michael Tchagaspanian, EVP Technology Strategic Partnership, CEA-Leti, discusses the forthcoming CEA-Leti Innovation Days ...

HP has selected the Hailo-10H AI accelerator to power its all-new HP AI Accelerator M.2 Card. HP is the first to market with ...

This week, at the 2025 IEEE International Interconnect Technology Conference (IITC), imec presents Ru lines at 16nm pitch ...

TTI IP&E – Europe, a leading specialty distributor of electronic components, has won two awards from Vishay, a leader in ...

Mr. Theodoras brings to Scintil over 35 years of industry experience in electronics and optics, with skills in project ...

Systems®, a leading camera solutions provider for embedded vision applications, and Shikino High-Tech, a Japanese company ...

At the IEEE ECTC 2025 conference, imec highlights the exceptional performance and flexibility of its 300mm RF silicon ...

xMEMS µCooling’s solid-state, piezoMEMS design includes no motors or moving bearings, therefore no mechanical wear, enabling ...