Design And Reuse

TSMC Board of Directors Meeting Resolutions

In addition, the ex-dividend date and the record date for entitlement to participate in this cash dividend distribution for TSMC American Depositary Shares (ADSs) will be September 16, 2026. To meet ...
Design And Reuse

Korean economy projected to expand 2.5% in 2026 on chips: KDI

The Korean economy is projected to expand 2.5 percent in 2026, supported by strong growth in the semiconductor industry and a recovery in domestic consumption, a state-run think tank said Wednesday.
Design And Reuse

eMemory Technology Inc (ROCO:3529) Q1 2026 Earnings Call Highlights: Record Revenue Growth and Strategic Expansion

Memory Technology Inc (ROCO:3529) achieves a 20% revenue increase and expands into AI and high-speed interface applications, despite facing challenges in royalty revenue. eMemory Technology Inc ...
Design And Reuse

OSYX Technologies and Andes Technology Announce Strategic Collaboration on RISC-V Virtualization

OSYX Technologies, the company behind the open-source Bao Hypervisor, today announced a strategic collaboration with Andes Technology Corporation, a leading provider of high-performance, low-power 32- ...
Design And Reuse

QuickLogic Announces New Seven-Figure FPGA Hard IP Contract

QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened and Antifuse FPGAs, and ruggedized programmable solutions, announced today it has been ...
Design And Reuse

SiFive Sets New Bar for High-Performance RISC-V with Third-Generation Performance P550 and P570 IP

New high-performance OoO superscalar vector processor IP, ideal for area- and power-constrained consumer applications SiFive, Inc., the gold standard for RISC-V computing, today announced the launch ...
Design And Reuse

CEA-Leti Platform Offers Chipmakers Nanometre- Scale Strain Mapping

Strain engineering, which involves deliberately stretching or compressing a crystal lattice, is used to boost the speed of electron flow in a device. Even a fraction of percent change in lattice ...
Design And Reuse

Siemens democratizes EDA software access for European electronics industry through the Chips JU European Chips Design Platform (EuroCDP) project

Siemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semicond ...
Design And Reuse

LTSCT Expands Advanced Power Design Capabilities with Synopsys

L&T Semiconductor Technologies Ltd (LTSCT), a leading Indian fabless semiconductor company and a wholly-owned subsidiary of Larsen & Toubro (L&T), today announced a multiyear license agreement with ...
Design And Reuse

Apple-Intel Foundry Deal Could Reshape U.S. Chip Manufacturing

If realized at a meaningful scale, the partnership could reshape the economics of advanced semiconductor manufacturing, accelerate the transformation of Intel Foundry, and test the increasingly ...
Design And Reuse

Ceva Advances Full-Stack Wireless Vision with Next Generation Bluetooth High Data Throughput and Integrated RF Design Win

(NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced a major customer win for its Bluetooth® High Data Throughput (HDT) solution including Ceva’s ...
Design And Reuse

EXTOLL announces Availability of Industry´s first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration

EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, announces the availability and readiness for customer integration of the industry´s first 16G UCIe PHY IP ...