ROLEC unveils range of diecast aluminium enclosures designed to protect in‑cab human-machine interface (HMI) systems.

Imec has announced that its ASIC and silicon photonics services division, IC‑Link, has joined TSMC’s 3DFabric Alliance.

binder has launched a new hybrid connector designed to support “One Cable Automation” systems, combining power supply and ...

Greg Robinson, corporate vice president at Microchip, added that the launch reflects a broader strategy to expand its ...

Under chatbot-based architectures, the typical CPU-to-GPU ratio ranged from 1:4 to 1:8. With agentic AI, this is shifting ...

Emerson has announced plans to extend its artificial intelligence capabilities across its test and measurement software.

TDK has launched a new series of non-isolated DC-DC converters designed for industrial and battery powered applications.

ByteSnap Design has introduced an online tool designed to help developers evaluate embedded project feasibility.

Anglia Components has entered into a pan-European authorised distribution agreement with Same Sky, extending its product ...

OSRAM has agreed to sell its CMOS image sensor (CIS) business to indie Semiconductor in a deal valued at €40m.

Paragraf has expanded its graphene-based electronics portfolio with the launch of a new Graphene Field Effect Transistor (GFET), marking a further step in scaling production of its semiconductor ...

Lane Electronics has added HellermannTyton heat shrink range for harsh environment applications to its portfolio.