ROLEC unveils range of diecast aluminium enclosures designed to protect in‑cab human-machine interface (HMI) systems.

Imec has announced that its ASIC and silicon photonics services division, IC‑Link, has joined TSMC’s 3DFabric Alliance.

binder has launched a new hybrid connector designed to support “One Cable Automation” systems, combining power supply and ...

Emerson has announced plans to extend its artificial intelligence capabilities across its test and measurement software.

Greg Robinson, corporate vice president at Microchip, added that the launch reflects a broader strategy to expand its ...

Under chatbot-based architectures, the typical CPU-to-GPU ratio ranged from 1:4 to 1:8. With agentic AI, this is shifting ...

TDK has launched a new series of non-isolated DC-DC converters designed for industrial and battery powered applications.

ByteSnap Design has introduced an online tool designed to help developers evaluate embedded project feasibility.

Anglia Components has entered into a pan-European authorised distribution agreement with Same Sky, extending its product ...

OSRAM has agreed to sell its CMOS image sensor (CIS) business to indie Semiconductor in a deal valued at €40m.

Paragraf has expanded its graphene-based electronics portfolio with the launch of a new Graphene Field Effect Transistor (GFET), marking a further step in scaling production of its semiconductor ...

Lane Electronics has added HellermannTyton heat shrink range for harsh environment applications to its portfolio.